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Bhubaneswar : In a major boost to India’s semiconductor ambitions, the Government of Odisha has announced that Intel Corporation and 3D Glass Solutions (3DGS) have signed a Memorandum of Understanding (MoU) to explore the establishment of an advanced semiconductor glass core packaging substrate manufacturing facility in the state. The proposed project, estimated at approximately ₹28,000 crore, has the potential to become one of the largest technology investments in Eastern India. Subject to regulatory approvals, business feasibility assessments, and financial support from the State and Central Governments, the facility could position Odisha as a strategic destination for semiconductor manufacturing, advanced packaging technologies, artificial intelligence (AI) infrastructure, next-generation data centres and digital innovation. Landmark Step Towards Building a Semiconductor Ecosystem The proposed facility is expected to manufacture advanced glass core substrates, a critical component in next-generation semiconductor packaging technologies. These substrates play a vital role in supporting high-performance computing, AI applications, data-intensive workloads and advanced electronics. Industry experts view glass core substrates as a key technology for future semiconductor architectures due to their superior performance, scalability and efficiency compared to conventional materials. If realized, the project would strengthen India’s semiconductor value chain while placing Odisha among emerging global centres for advanced chip packaging technologies. The Government of Odisha signed a landmark MoU with Intel Corporation and 3DGS Inc. for the establishment of an Advanced Packaging Glass Core Substrate Manufacturing Facility in Odisha. The initiative marks a significant milestone in the State’s industrial transformation,... pic.twitter.com/cbytpOLdvU — CMO Odisha (@CMO_Odisha) May 30, 2026 The state government described the initiative as a transformational opportunity that aligns with India’s broader objective of reducing dependence on imported semiconductor components and enhancing domestic manufacturing capabilities. Odisha Opens Doors to Global Technology Partners The Government of Odisha has extended an invitation to global technology companies, research institutions, industry stakeholders and ecosystem partners to participate in the development of what it envisions as one of Asia’s most advanced semiconductor and digital infrastructure ecosystems. Read More: Life of Women Under the Taliban: How Afghanistan turned into the world’s harshest gender apartheid regime Officials believe the project could act as a catalyst for attracting ancillary industries, semiconductor suppliers, research centres and technology startups, creating a robust industrial ecosystem around the proposed facility. The initiative is also expected to complement Odisha’s efforts to diversify its industrial base beyond traditional sectors and accelerate its transition towards high-technology manufacturing and innovation-driven growth. Industry Leaders Express Confidence Welcoming the collaboration, Babu Mandava, Chief Executive Officer of 3D Glass Solutions, emphasized the significance of the proposed venture for India’s technology future. “We are grateful for the strong support of the Government of Odisha and excited about our collaboration with Intel in exploring this opportunity. This initiative has the potential to establish India as a key global hub for advanced glass substrates and semiconductor packaging, supporting high-growth sectors such as artificial intelligence, high-performance computing and next-generation electronics,” he said. Naga Chandrasekaran, Executive Vice President and General Manager of Intel Foundry, highlighted Intel’s commitment to advancing packaging technologies and supporting innovation within the semiconductor industry. “Intel Foundry is proud to collaborate with 3DGS in exploring this opportunity with the Government of Odisha. As a pioneer in glass core substrate technology, we are excited about the potential of this collaboration to accelerate the commercialization of next-generation advanced packaging solutions globally,” he stated. Government Sees Transformational Economic Impact Odisha Chief Secretary Anu Garg described the MoU as a significant milestone in the state’s industrial and technological development journey. “This MoU marks a transformative step in Odisha’s journey towards becoming a key player in advanced semiconductor and electronics manufacturing. With strong policy support, skilled talent and integrated infrastructure, Odisha is ready to contribute meaningfully to India’s semiconductor ambitions,” she said. Odisha Focused on Creating Jobs Through Technology-Led Growth : Minister Mahaling Dr. Mukesh Mahaling, Odisha’s Minister for Electronics and Information Technology, Health and Family Welfare, and Parliamentary Affairs, reiterated the government’s commitment to creating an investor-friendly ecosystem. “Odisha remains focused on building a conducive ecosystem that promotes innovation, facilitates investments, creates job opportunities and drives inclusive growth across industries,” he said. ସେମିକଣ୍ଡକ୍ଟର ଶିଳ୍ପ କ୍ଷେତ୍ରରେ ଓଡ଼ିଶା ସାଜୁଛି ଉଦାହରଣ ଡବଲ୍ ଇଞ୍ଜିନ୍ ସରକାରରେ ପ୍ରଯୁକ୍ତିବିଦ୍ୟା କ୍ଷେତ୍ରରେ ଓଡ଼ିଶାର ବିକାଶ ତ୍ୱରାନ୍ୱିତ ହେଉଛି। ଯଶସ୍ଵୀ ପ୍ରଧାନମନ୍ତ୍ରୀ ଶ୍ରୀ ନରେନ୍ଦ୍ର ମୋଦୀଜୀଙ୍କ ମାର୍ଗଦର୍ଶନ ତଥା ମାନ୍ୟବର ମୁଖ୍ୟମନ୍ତ୍ରୀ ଶ୍ରୀ ମୋହନ ଚରଣ ମାଝୀଙ୍କ ନେତୃତ୍ୱରେ ଭୁବନେଶ୍ୱର–ଖୋର୍ଦ୍ଧା ଅଞ୍ଚଳରେ ଏକ... pic.twitter.com/sGwyWm6S9v — Dr. Mukesh Mahaling (@MahalingMukesh) May 30, 2026 The state government noted that the project is expected to generate large-scale employment opportunities for Odisha’s youth. Besides creating high-skilled jobs in semiconductor manufacturing and engineering, the initiative is also expected to boost skill development programmes and attract supporting industries to the region. ‘Strengthening Domestic Manufacturing Is a National Priority’: Vaishnaw Union Minister for Electronics and Information Technology, Railways and Information & Broadcasting, Ashwini Vaishnaw, welcomed the initiative and linked it to India’s larger manufacturing and economic goals. “This initiative reflects India’s larger vision of strengthening domestic manufacturing capabilities and positioning the country as a global economic powerhouse,” he said. Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance semiconductor ecosystem in India. pic.twitter.com/elxs6r8muN — Ashwini Vaishnaw (@AshwiniVaishnaw) May 29, 2026 The proposed investment comes at a time when India is actively pursuing semiconductor self-reliance through policy incentives, infrastructure development and strategic partnerships with global technology leaders. Chief Minister Outlines Odisha’s Technology Future Chief Minister Mohan Charan Majhi described the MoU as the beginning of a new chapter in Odisha’s development story. “Odisha is entering a decisive new era of industrial and technological transformation. The proposed Advanced Packaging Glass Core Substrate Manufacturing Facility in the Bhubaneswar-Khurda region is a landmark step towards strengthening India’s semiconductor ecosystem and positioning Odisha as a hub for next-generation technology manufacturing,” he said. Odisha is entering a decisive new era of industrial and technological transformation. Today, we signed an MoU with Intel Corporation and 3DGS Inc. for the establishment of an Advanced Packaging Glass Core Substrate Manufacturing Facility in the Bhubaneswar–Khurda region, a... pic.twitter.com/IgQPNdgtO6 — Mohan Charan Majhi (@MohanMOdisha) May [...]
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